Job Title

Yield Engineer, MicroLED

Job Title

Yield Engineer

Role Summary

As a Yield Engineer at Avicena, you will be the technical detective behind our microLED and photodetector device programs — isolating, characterizing, and root-causing failures across devices, arrays, and integrated modules. Your findings will directly steer design, process, and reliability decisions for the LightBundle™ platform, closing the loop between what fails in the lab and how we build it better.

Key Responsibilities

• Root-cause analysis: Lead end-to-end yield improvement and failure analysis of GaN microLEDs, photodetector arrays, and integrated interconnect modules, from failure isolation through physical root cause and corrective action.
• Data analysis: Perform data analysis of production and experimental lots, identify sources of variability and process improvements.
• FA techniques: Plan and perform electrical, optical, and physical FA including EL/PL imaging, SIMS, EMMI/photoemission, OBIRCH/thermal, curve tracing, and fault localization on single devices and dense arrays.
• Physical analysis: Direct and interpret cross-sectioning and imaging (FIB, SEM, TEM, EDX, CT/acoustic microscopy) to identify defects, material anomalies, and interface issues.
• Failure characterization: Build failure signatures and defect libraries; distinguish process-induced, design-induced, and stress-induced failure modes.
• Feedback loop: Translate FA findings into actionable recommendations for device, process, packaging, and reliability teams, and verify effectiveness of corrective actions.
• Reporting: Produce clear, rigorous FA reports and present root-cause conclusions to engineering and leadership; support customer and foundry-facing analyses.
  
  

Required Qualifications

• Education: MS or PhD in Electrical Engineering, Materials Science, Physics, or a related field (or BS with equivalent industry experience).
• Experience: 5–8+ years of failure analysis experience in semiconductor, optoelectronic, or photonic devices.
• Root-cause rigor: Demonstrated ability to drive structured root-cause investigations (8D, fishbone, fault-tree) to definitive physical conclusions.
• Device physics: Solid understanding of semiconductor and optoelectronic device physics and common failure/degradation mechanisms.
• Analysis skills: Proficiency in data analysis and scripting (e.g., Python, MATLAB) and strong technical communication.
  
  

Preferred Qualifications

• GaN microLEDs: Prior experience with GaN-based microLED or LED/laser failure analysis is strongly preferred but not required.
• Experience with FA on high-density emitter or detector arrays.
• Familiarity with packaging, hybrid bonding, or heterogeneous-integration failure modes.
• Experience supporting reliability qualification and correlating FA to stress-test results.
• Background in optical/photonic module or interconnect FA.