Job Title

Senior Reliability Technician

Job Title

Reliability Senior Technician

Key Responsibilities

• • Stress Testing & Qualification: Set up, execute, and monitor industry-standard semiconductor reliability stress tests, including HTOL (High-Temperature Operating Life), THB (Temperature Humidity Bias), Thermal Cycling, etc
• • Lab Equipment Operation & Maintenance: Program, operate, and troubleshoot environmental chambers, burn-in boards, socket fixtures, and test equipment or benchtop instruments (SMUs, oscilloscopes, multi-meters, etc).
• • Failure Isolation & Initial Analysis: Perform preliminary electrical characterization on stressed or failed devices to isolate failure modes (e.g., curve tracing, leakage measurement, shorts/opens analysis).
• • Data Management & Reporting: Collect and organize test datasets.
• • Cross-Functional Support: Collaborate daily with Reliability Engineer(s), Design Engineers, and Test Development team to troubleshoot equipment discrepancies/ abnormalities during/after stress tests/etc.
    

Qualifications & Requirements

• • Experience: 3+ years of hands-on technical experience in a semiconductor reliability, failure analysis, or high-reliability manufacturing lab environment.
• • Technical Knowledge:
  • Basic working knowledge of semiconductor physics, device packaging, and failure mechanisms.
  • Familiarity with industry reliability standards such as JEDEC/Telcordia/etc
  • Comfort using PC-based test interfaces and operating pre-existing Python programs or scripts to initialize test stations, run DUTs, and capture data.
• • Tool Proficiency:
  • Proficiency with lab instruments (Source Measure Units, signal generators, curve tracers, oscilloscopes, etc).
  • Experience programming and managing environmental test chambers and burn-in systems.
  • Basic familiarity with failure analysis tools (Optical Microscopy, electrical verification, etc).
    

Preferable (but Not Obligatory) Skills

• • PCB Repair & Soldering: Capability to perform fine-pitch surface-mount (SMT) and through-hole soldering, component-level troubleshooting, and custom modification or repair of test boards and printed circuit boards (PCBs).
• • Wire Bonding: Experience with manual or semi-automated wedge/wedge wire bonders for sample preparation, samples rewiring, or repairing broken connections on test devices